Call for Papers

The First International Workshop on Next Generation of Wireless and Mobile Networks (NGWMN-08)

(http://www.cs.uc.edu/~qzeng/NGWMN2008/NGWMN2008.htm)

To be held in conjunction with ICPP-08 (http://www.cse.ohio-state.edu/~icpp2008/)

Portland, Oregon, USA, September 8-12, 2008

SCOPE:  The next generation of wireless and mobile networks is expected to allow a single mobile user to access heterogeneous wireless and mobile networks.  Since wireless cellular networks such as 3G systems (e.g., WCDMA, UMTA, cdma200, etc) and WLANs (e.g., IEEE 802.11a/b/e/g/n, WiMax, etc) are two typical existing networks, the integration and interoperability issues become new  challenges. The internetworking of different types of wireless and mobile networks aims to provide seamless services for the mobile users among different type of networks. Due to the heterogeneity of different radio access techniques, different types of traffic and applications, Quality of Service (QoS) guarantee also becomes a critical issue for an integrated wireless and mobile network. Therefore, this workshop will provide a timely technical forum for the dissemination of new results in this exciting research area and is devoted to the architectures, protocols, resource management, mobility management, and scheduling in integrated wireless and mobile networks.  Topics of interest include, but are not limited to:

- Architecture of integrated heterogamous networks

- Handoff and mobility management

- Integration of heterogeneous networks

- Resource management

- Multi-interface access protocols

- QoS provisioning

- Cross-layer design and optimization

- Load balancing and activity scheduling

- MAC protocols

- Network management and planning

- Routing protocols

- Multimedia communications

- Multicasting and broadcasting protocols

- Performance analysis and optimization

- Congestion control algorithms and scheduling

- Cooperation and trust management

- Topology control and management

- Network topology

- Security issue of internetworking

- Opportunistic networks

SUBMISSION:  Authors are invited to submit their research papers following the IEEE Computer Society Proceedings Manuscripts style: two columns, single-spaced, including figures and references, using 10 fonts, and number each page.  The papers should be 6 pages long. They will be carefully evaluated based on originality, significance, technical soundness, and clarity of exposition. The papers should be submitted electronically via ICPP-08 website. If there is any problem during submission please contact any of the Workshop Co-chairs. Accepted papers will be given guidelines in preparing and submitting the final manuscript(s) together with the notification of acceptance.

MPORTANT DATES:

Paper Submission:

April 20, 2008

Author Notification:

May 20, 2008

Final Manuscript Due:

June 2, 2008

WORKSHOP CO-CHAIRS:

Mieso Denko

University of Guelph, Canada

(denko@cis.uoguelph.ca)

Qing-An Zeng

University of Cincinnati, USA

(qing.zeng@uc.edu)

Leonard Barolli

Fukuoka Institute of Technology, Japan

(barolli@fit.ac.jp)

COMMITTEE MEMBERS: (Tentative)

Dargie, Waltenegus: Technical University of Dresden, Germany

Iwan, Irfan: University of Bradford, UK

Zhang, Yan: Simula Research Lab, Norway

Babulak, Eduard: FDU-Vancouver, Canada

Hung, Patrick: UOIT, Canada

Liu, Ren P.: CSIRO ICT Center, Australia

Shakshuki, Elhadi: Acadia University, Canada

Lung, Chung-Horng , Carleton University, Canada

Xie, Bin: University of Cincinnati, USA

Ma, Maode, Nanyang Technological University, Singapore

Guo, Jinhua: University of Michigan-Dearborn, USA

Akio Koyama, Yamagata University, Japan

Wang, Bin: Wright State University, USA

Wu, Kui,  The University of British Columbia, Canada

Zhang, Jingyuan: University of Alabama, USA

Zhou, Xuefu: University of Cincinnati, USA

Li, Xiaolong: Morehead State University

Liu, Huazhou: Motorola Inc., USA

Liu, Yun: Beijing Jiaotong University, China

Jia, Weijia: City University of Hong Kong, China

Wang, Haitang: Motorola Inc., USA

Shen, Wei: Microsoft Inc., USA

Arjan Durresi, Indiana University Purdue University Indianapolis, USA

Giuseppe De Marco, Toyota Technological Institute, Japan